i ntegrated c ircuits d ivision www.ixysic.com ds-LAA710-r03 1 LAA710 dual single-pole, normally open optomos ? relay e 3 pb part # description LAA710 8-pin dip (50/tube) LAA710s 8-pin surface mount (50/tube) LAA710str 8-pin surface mount (1,000/reel) parameter ratings units blocking voltage 60 v p load current 1 a rms / a dc on-resistance (max) 0.5 ? applications features description approvals ordering information pin configuration switching characteristics of normally open (form a) devices ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? no moving parts ? high reliability ? arc-free with no snubbing circuits ? no emi/rfi generation ? small 8-pin package ? machine insertable, wave solderable ? surface mount tape & reel versions available ? telecommunications ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment-patient/equipment isolation ? security ? aerospace ? industrial controls 1 2 3 4 8 7 6 5 + control - switch #1 C control - switch #1 + control - switch #2 C control - switch #2 load - switch #1 load - switch #1 load - switch #2 load - switch #2 ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 form-a i f i load 10% 90% t on t off LAA710 is a dual normally open (1-form-a) solid state relay that comprises two independently controlled, optically coupled mosfet switches. the combination of super efficient mosfet switches and photovoltaic die provides 3750v rms of input to output isolation. the optically coupled outputs, which use the patented optomos architecture, are controlled by a highly efficient gaaias infrared led. dual optomos relay provides a more compact design solution than discrete single-pole relays in a variety of applications, and saves board space by incorporating both switches in a single 8-pin package.
i ntegrated c ircuits d ivision www.ixysic.com 2 r03 LAA710 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current continuous 1 -i l --1a rms / a dc peak t =10ms i lpk --5 a p on-resistance 2 i l =1a r on - - 0.5 ? off-state leakage current v l =60v p i leak --1 ? a switching speeds turn-on i f =5ma, v l =10v t on - - 2.5 ms turn-off t off - - 0.25 output capacitance v l =50v, f=1mhz c out - 220 - pf input characteristics input control current to activate i l =150ma i f - - 10 ma input control current to deactivate - - 0.4 0.7 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o -3- pf 1 if both poles operate, the load current must be derated so as not to exceed the package power dissipation value. 2 measurement taken within one (1) second of on-time. parameter ratings units blocking voltage 60 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / c 2 derate linearly 6.67 mw / c absolute maximum ratings @ 25c electrical characteristics @ 25c
i ntegrated c ircuits d ivision LAA710 www.ixysic.com 3 r03 performance data @25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. typical led forward voltage drop (n=50, i f =10ma) 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage (v) device count (n) typical turn-on time (n=50, i f =10ma, i l =1a dc ) 0.7 1.1 1.5 0.5 0.9 1.3 turn-on time (ms) device count (n) 25 20 15 10 5 0 typical turn-off time (n=50, i f =10ma, i l =1a dc ) 0.05 0.09 0.13 0.03 0.07 0.11 turn-off time (ms) device count (n) 25 20 15 10 5 0 typical i f for switch operation (n=50, i l =1a dc ) 1.25 2.25 3.25 1.75 2.75 3.75 led current (ma) device count (n) 25 20 15 10 5 0 typical i f for switch dropout (n=50, i l =1a dc ) 25 20 15 10 5 0 1.25 2.25 3.25 1.75 2.75 3.75 led current (ma) device count (n) typical on-resistance distribution (n=50, i f =10ma, i l =1a dc ) 35 30 25 20 15 10 5 0 0.215 0.225 0.235 0.255 0.245 0.265 on-resistance ( : ) device count (n) typical blocking voltage distribution (n=50) 35 30 25 20 15 10 5 0 72 74 76 78 80 82 blocking voltage (v p ) device count (n) typical led forward voltage drop vs. temperature temperature (oc) led forward voltage drop (v) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f =50ma i f =30ma i f =20ma i f =10ma typical turn-on time vs.led forward current (i l =1a dc ) forward current (ma) turn-on time (ms) 0 5 1015202530354045 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-off time vs. led forward current (i l =1a dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 50
i ntegrated c ircuits d ivision www.ixysic.com 4 r03 LAA710 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @25oc (unless otherwise noted)* typical turn-on time vs. temperature (i l =1a dc ) temperature (oc) i f =20ma turn-on time (ms) -40 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -20 0 20 40 60 80 100 i f =10ma typical turn-off time vs. temperature (i f =10ma, i l =1a dc ) temperature (oc) turn-off time (ms) -40 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -20 0 20 40 60 80 100 typical on-resistance vs. temperature (i f =10ma, i l =1a dc ) temperature (oc) on-resistance ( : ) -40 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -20 0 20 40 60 80 100 typical i f for switch operation vs. temperature (i l =1a dc ) temperature (oc) led current (ma) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 typical i f for switch dropout vs. temperature (i l =1a dc ) temperature (oc) led current (ma) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 typical load current vs. load voltage (i f =10ma) load voltage (v) load current (ma) 1000 800 600 400 200 0 -200 -400 -600 -800 -1000 -0.3 -0.2 -0.1 0.1 0.2 0 0.3 typical blocking voltage vs. temperature temperature (oc) blocking voltage (v p ) -40 81 80 79 78 77 76 75 74 73 -20 0 20 40 60 80 100 typical leakage vs. temperature measured across pins 5 & 6, 7 & 8 temperature (oc) leakage ( p a) -40 0.007 0.006 0.005 0.004 0.003 0.002 0.001 0 -20 0 20 40 60 80 100 energy rating curve time load current (a) 8 7 6 5 4 3 2 1 0 10 p s 1ms 100ms 10s 100 p s 10ms 1s 100s maximum load current vs. temperature temperature (oc) load current (ma) 1800 1600 1400 1200 1000 800 600 400 -40 -20 0 20 40 60 80 120 100 i f = 20ma i f = 10ma i f = 5ma
i ntegrated c ircuits d ivision LAA710 www.ixysic.com 5 r03 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating LAA710 / LAA710s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time LAA710 / LAA710s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 6 r03 LAA710 mechanical dimensions LAA710s LAA710str tape & reel dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1 dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406)
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com 7 LAA710 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-LAA710-r03 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/19/2012 mechanical dimensions LAA710 dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005)
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